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Model # |
Đơn giá (VND) |
Stock ? |
Nhà sản xuất |
Min order |
RoHS status |
Seri |
Kiểu đóng gói |
Trạng thái sản phẩm |
Tài liệu |
Type | Composition | Diameter | Melting Point | Flux Type | Wire Gauge | Mesh Type | Process | Form | Shelf Life | Shelf Life Start | Storage/Refrigeration Temperature | Add selected items to basket |
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- immediate |
SRA Soldering Products |
1 |
RoHS non-compliant |
- |
Spool |
Active |
Tài liệu
|
Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.031" (0.79mm) | - | Water Soluble | - | - | Lead Free | Spool, 1 lb (453.59g) | 24 Months | Date of Manufacture | - |
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- immediate |
SRA Soldering Products |
1 |
ROHS3 Compliant |
- |
Spool |
Active |
Tài liệu
|
Wire Solder | - | 0.031" (0.79mm) | 423°F (217°C) | Rosin Activated (RA) | - | - | Lead Free | Spool, 1 lb (453.59g) | - | - | - |
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- immediate |
Chip Quik Inc. |
1 |
ROHS3 Compliant |
Smooth Flow™ |
Bulk |
Active |
Tài liệu
|
Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 422 ~ 428°F (217 ~ 220°C) | No-Clean | - | 5 | Lead Free | Jar, 8.8 oz (250g) | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
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- immediate |
Chip Quik Inc. |
1 |
ROHS3 Compliant |
- |
Bulk |
Active |
Tài liệu
|
Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.020" (0.51mm) | 422 ~ 428°F (217 ~ 220°C) | No-Clean | 24 AWG, 25 SWG | Lead Free | Spool, 1 lb (454 g) | - | - | - | - |
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- immediate |
SRA Soldering Products |
1 |
RoHS non-compliant |
- |
Spool |
Active |
Tài liệu
|
Wire Solder | Sn96Ag4 (96/4) | 0.045" (1.14mm) | 430°F (221°C) | Rosin Activated (RA) | 14 AWG, 16 SWG | Lead Free | Spool, 1 lb (454 g) | 24 Months | Date of Manufacture | - | - |
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- immediate |
Chip Quik Inc. |
1 |
RoHS non-compliant |
SMD2 |
Bulk |
Active |
Tài liệu
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Solder Sphere | Sn63Pb37 (63/37) | 0.018" (0.46mm) | 361°F (183°C) | - | - | Leaded | Jar | 24 Months | Date of Manufacture | - | - |
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- immediate |
SRA Soldering Products |
1 |
RoHS non-compliant |
- |
Spool |
Active |
Tài liệu
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Wire Solder | Sn97Cu3 (97/3) | 0.020" (0.51mm) | - | Water Soluble | - | Lead Free | Spool, 1 lb (453.592g) | 24 Months | Date of Manufacture | - | - |
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- immediate |
Chip Quik Inc. |
1 |
RoHS non-compliant |
- |
Bulk |
Active |
Tài liệu
|
Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 4 | Leaded | Cartridge, 17.64 oz (500g) | 12 Months | Date of Manufacture | 68°F ~ 77°F (20°C ~ 25°C) |
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- immediate |
Chip Quik Inc. |
1 |
ROHS3 Compliant |
- |
Bulk |
Active |
Tài liệu
|
Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.031" (0.79mm) | 422 ~ 428°F (217 ~ 220°C) | Rosin Activated (RA) | 21 AWG, 20 SWG | Lead Free | Spool, 1 lb (454 g) | - | - | - | - |
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- immediate |
Chip Quik Inc. |
1 |
ROHS3 Compliant |
- |
Bulk |
Active |
Tài liệu
|
Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.031" (0.79mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | 20 AWG, 22 SWG | Lead Free | Spool, 1 lb (454 g) | - | - | - | - |
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- immediate |
SRA Soldering Products |
1 |
RoHS non-compliant |
- |
Spool |
Active |
Tài liệu
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Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.032" (0.81mm) | 430°F (221°C) | No-Clean | 20 AWG, 21 SWG | Lead Free | Spool, 1 lb (454 g) | - | - | - | - |
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- immediate |
Chip Quik Inc. |
1 |
ROHS3 Compliant |
- |
Bulk |
Active |
Tài liệu
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Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.015" (0.38mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | 27 AWG, 28 SWG | Lead Free | Spool, 1 lb (454 g) | - | - | - | - |
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|
- immediate |
Chip Quik Inc. |
1 |
ROHS3 Compliant |
- |
Bulk |
Active |
Tài liệu
|
Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.015" (0.38mm) | 422 ~ 428°F (217 ~ 220°C) | Rosin Activated (RA) | 27 AWG, 28 SWG | Lead Free | Spool, 1 lb (454 g) | - | - | - | - |
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- immediate |
Chip Quik Inc. |
1 |
RoHS non-compliant |
SMD2 |
Bulk |
Active |
Tài liệu
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Solder Sphere | Sn63Pb37 (63/37) | 0.014" (0.36mm) | 361°F (183°C) | - | - | Leaded | Jar | 24 Months | Date of Manufacture | - | - |
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- immediate |
MG Chemicals |
1 |
ROHS3 Compliant |
4900 |
Spool |
Active |
Tài liệu
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Wire Solder | Sn96.2Ag2.8Cu0.4 (96.2/2.8/0.4) | 0.032" (0.81mm) | 423 ~ 430°F (217 ~ 221°C) | No-Clean | 20 AWG, 21 SWG | Lead Free | Spool, 8 oz (227g), 1/2 lb | 60 Months | Date of Manufacture | 50°F ~ 86°F (10°C ~ 30°C) | - |
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- immediate |
Kester Solder |
1 |
RoHS non-compliant |
285 |
Bulk |
Active |
Tài liệu
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Wire Solder | Sn60Pb40 (60/40) | 0.062" (1.57mm) | 361 ~ 374°F (183 ~ 190°C) | Rosin Mildly Activated (RMA) | 14 AWG, 16 SWG | Leaded | Spool, 1 lb (454 g) | 36 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - |
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- immediate |
Chip Quik Inc. |
1 |
ROHS3 Compliant |
SMD |
Bulk |
Active |
Tài liệu
|
Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 422 ~ 428°F (217 ~ 220°C) | No-Clean | - | 6 | Lead Free | Jar, 1.76 oz (50g) | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
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- immediate |
Chip Quik Inc. |
1 |
ROHS3 Compliant |
CHIPQUIK® |
Bulk |
Active |
Tài liệu
|
Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423°F (217°C) | No-Clean | - | 3 | Lead Free | Jar, 17.64 oz (500g) | 12 Months | Date of Manufacture | - |
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|
- immediate |
Chip Quik Inc. |
1 |
RoHS non-compliant |
CHIPQUIK® |
Bulk |
Active |
Tài liệu
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Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | Water Soluble | - | 4 | Leaded | Jar, 17.64 oz (500g) | 6 Months | Date of Manufacture | - |
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|
- immediate |
Chip Quik Inc. |
1 |
RoHS non-compliant |
SMD2 |
Bulk |
Active |
Tài liệu
|
Solder Sphere | Sn63Pb37 (63/37) | 0.010" (0.25mm) | 361°F (183°C) | - | - | Leaded | Jar | 24 Months | Date of Manufacture | - | - |
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