|
Model # |
Đơn giá (VND) |
Stock ? |
Nhà sản xuất |
Min order |
RoHS status |
Seri |
Kiểu đóng gói |
Trạng thái sản phẩm |
Tài liệu |
Type | Composition | Diameter | Melting Point | Flux Type | Wire Gauge | Mesh Type | Process | Form | Shelf Life | Shelf Life Start | Storage/Refrigeration Temperature | Add selected items to basket |
|
|
|
- immediate |
Chip Quik Inc. |
1 |
ROHS3 Compliant |
CHIPQUIK® |
Bulk |
Active |
Tài liệu
|
Ribbon Solder | In52Sn48 (52/48) | - | 244°F (118°C) | - | - | Lead Free | Spool | - | - | - | - |
|
|
|
|
- immediate |
Chip Quik Inc. |
1 |
ROHS3 Compliant |
SMD |
Bulk |
Active |
Tài liệu
|
Ribbon Solder | In100 (100) | - | 315°F (157°C) | - | - | Lead Free | Spool | - | - | - | - |
|
|
|
|
- immediate |
Apex Tool Group |
1 |
Unknown |
Weller® |
Spool |
Active |
Tài liệu
|
Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.031" (0.79mm) | - | No-Clean | - | Lead Free | Spool, 8.8 oz (250g) | - | - | - | - |
|
|
|
|
- immediate |
MG Chemicals |
1 |
RoHS non-compliant |
4890 |
Spool |
Active |
Tài liệu
|
Wire Solder | Sn60Pb40 (60/40) | 0.032" (0.81mm) | 361 ~ 376°F (183 ~ 191°C) | Rosin Activated (RA) | 20 AWG, 21 SWG | Leaded | Spool, 1 lb (454 g) | 60 Months | Date of Manufacture | 50°F ~ 86°F (10°C ~ 30°C) | - |
|
|
|
|
- immediate |
Chip Quik Inc. |
1 |
ROHS3 Compliant |
CHIPQUIK® |
Bulk |
Active |
Tài liệu
|
- | - | - | 144°F (62°C) | No-Clean, Water Soluble | - | - | Lead Free | - | - | - | - |
|
|
|
|
- immediate |
Chip Quik Inc. |
1 |
ROHS3 Compliant |
CHIPQUIK® SMD4300 |
Dispenser |
Active |
Tài liệu
|
Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean, Water Soluble | - | 4 | Leaded | Syringe, 1.23 oz (35g), 10cc | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
|
|
|
- immediate |
Chip Quik Inc. |
1 |
ROHS3 Compliant |
CHIPQUIK® |
Bulk |
Active |
Tài liệu
|
Wire Solder | Sn60Pb40 (60/40) | 0.015" (0.38mm) | 361°F ~ 370°F (183°C ~ 188°C) | No-Clean | - | Leaded | Spool, 4 oz (113.40g) | - | - | - | - |
|
|
|
|
- immediate |
Chip Quik Inc. |
1 |
RoHS non-compliant |
- |
Bulk |
Active |
Tài liệu
|
Wire Solder | Sn63Pb37 (63/37) | 0.031" (0.79mm) | 361°F (183°C) | Rosin Activated (RA) | 21 AWG, 20 SWG | Leaded | Spool, 8 oz (227g), 1/2 lb | - | - | - | - |
|
|
|
|
- immediate |
Chip Quik Inc. |
1 |
ROHS3 Compliant |
Super Low Dross™ |
Bulk |
Active |
Tài liệu
|
Bar Solder | Sn60Pb40 (60/40) | - | 361 ~ 370°F (183 ~ 188°C) | - | - | Leaded | Bar, 1 lb (454g) | - | - | - | - |
|
|
|
|
- immediate |
Chip Quik Inc. |
1 |
RoHS non-compliant |
- |
Bulk |
Active |
Tài liệu
|
Wire Solder | Sn63Pb37 (63/37) | 0.020" (0.51mm) | 361°F (183°C) | Rosin Activated (RA) | 24 AWG, 25 SWG | Leaded | Spool, 8 oz (227g), 1/2 lb | - | - | - | - |
|
|
|
|
- immediate |
Apex Tool Group |
1 |
ROHS3 Compliant |
Weller® |
Spool |
Active |
Tài liệu
|
Wire Solder | Sn99.3Cu0.6Ni0.05 (99.3/0.6/0.05) | 0.012" (0.31mm) | - | No-Clean | - | Lead Free | Spool, 3.53 oz (100g) | - | - | - | - |
|
|
|
|
- immediate |
Chip Quik Inc. |
1 |
ROHS3 Compliant |
CHIPQUIK® |
Bulk |
Active |
Tài liệu
|
Wire Solder | In100 (100) | 0.016" (0.40mm) | 315°F (157°C) | No-Clean | - | Lead Free | Spool | 60 Months | Date of Manufacture | - | - |
|
|
|
|
- immediate |
SRA Soldering Products |
1 |
RoHS non-compliant |
SUPER-PURE™ |
Bag |
Active |
Tài liệu
|
Bar Solder | Sn60Pb40 (60/40) | - | 361 ~ 370°F (183 ~ 188°C) | - | - | - | Bar, 1 lb (454g) | - | - | - | - |
|
|
|
|
- immediate |
Chip Quik Inc. |
1 |
ROHS3 Compliant |
SMD2 |
Bulk |
Active |
Tài liệu
|
Solder Sphere | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.008" (0.20mm) | 423 ~ 428°F (217 ~ 220°C) | - | - | Lead Free | Jar | 24 Months | Date of Manufacture | - | - |
|
|
|
|
- immediate |
Chip Quik Inc. |
1 |
ROHS3 Compliant |
- |
Bulk |
Active |
Tài liệu
|
Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.006" (0.15mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | - | Lead Free | Spool, 0.176 oz (5g) | - | - | - | - |
|
|
|
|
- immediate |
Apex Tool Group |
1 |
Unknown |
Weller® |
Spool |
Active |
Tài liệu
|
Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.031" (0.79mm) | - | No-Clean | - | Lead Free | Spool, 3.53 oz (100g) | - | - | - | - |
|
|
|
|
- immediate |
Harimatec Inc. |
1 |
RoHS non-compliant |
C400 |
Bulk |
Active |
Tài liệu
|
Wire Solder | Sn63Pb37 (63/37) | 0.015" (0.38mm) | 361°F (183°C) | No-Clean | 27 AWG, 28 SWG | Leaded | Spool, 8.8 oz (250g) | - | - | 59°F ~ 86°F (15°C ~ 30°C) | - |
|
|
|
|
- immediate |
Chip Quik Inc. |
1 |
ROHS3 Compliant |
- |
Spool |
Active |
Tài liệu
|
Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.020" (0.51mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | 24 AWG, 25 SWG | Lead Free | Spool, 4 oz (113.40g) | - | - | - | - |
|
|
|
|
- immediate |
Chip Quik Inc. |
1 |
ROHS3 Compliant |
- |
Bulk |
Active |
Tài liệu
|
Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | 4 | Lead Free | Syringe, 1.23 oz (35g), 10cc | 12 Months | Date of Manufacture | 68°F ~ 77°F (20°C ~ 25°C) |
|
|
|
|
- immediate |
Chip Quik Inc. |
1 |
ROHS3 Compliant |
SMD |
Bulk |
Active |
Tài liệu
|
Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.015" (0.38mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | - | Lead Free | Spool, 4 oz (113.40g) | - | - | - | - |
|