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Model # |
Đơn giá (VND) |
Stock ? |
Manufacturer |
Min order |
RoHS status |
Seri |
Package |
Part Status |
Datasheet |
Type | Composition | Diameter | Melting Point | Flux Type | Wire Gauge | Mesh Type | Process | Form | Shelf Life | Shelf Life Start | Storage/Refrigeration Temperature | Add selected items to basket |
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- immediate |
Chip Quik Inc. |
1 |
ROHS3 Compliant |
- |
Bulk |
Active |
Datasheet
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Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | 0.031" (0.79mm) | 441°F (227°C) | No-Clean | 20 AWG, 21 SWG | Lead Free | Spool, 1 lb (454 g) | - | - | - | - |
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- immediate |
Harimatec Inc. |
1 |
ROHS3 Compliant |
C400 |
Bulk |
Active |
Datasheet
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Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.022" (0.56mm) | 423°F (217°C) | No-Clean | 23 AWG, 24 SWG | Lead Free | Spool, 8.8 oz (250g) | - | - | 59°F ~ 86°F (15°C ~ 30°C) | - |
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- immediate |
Chip Quik Inc. |
1 |
ROHS3 Compliant |
- |
Bulk |
Active |
Datasheet
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Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | 4 | Lead Free | Jar, 8.8 oz (250g) | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
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- immediate |
Chip Quik Inc. |
1 |
ROHS3 Compliant |
- |
Bulk |
Active |
Datasheet
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Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 281°F (138°C) | No-Clean | - | 3 | Lead Free | Jar, 8.8 oz (250g) | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
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- immediate |
Chip Quik Inc. |
1 |
ROHS3 Compliant |
Super Low Dross™ |
Bulk |
Active |
Datasheet
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Bar Solder | Sn96.5Ag3.0Cu0.5 (96.5/3.0/0.5) | - | 422 ~ 428°F (217 ~ 220°C) | - | - | Lead Free | Bar, 1 lb (454g) | - | - | - | - |
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- immediate |
Chip Quik Inc. |
1 |
ROHS3 Compliant |
SMD |
Bulk |
Active |
Datasheet
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Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.006" (0.15mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | 34 AWG, 38 SWG | Lead Free | Spool, 1.76 oz (50g) | - | - | - | - |
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- immediate |
Chip Quik Inc. |
1 |
ROHS3 Compliant |
- |
Bulk |
Active |
Datasheet
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Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 281°F (138°C) | No-Clean | - | 4 | Lead Free | Jar, 8.8 oz (250g) | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
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- immediate |
Chip Quik Inc. |
1 |
ROHS3 Compliant |
- |
Bulk |
Active |
Datasheet
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Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 281°F (138°C) | No-Clean | - | 4 | Lead Free | Jar, 8.8 oz (250g) | 12 Months | Date of Manufacture | 68°F ~ 77°F (20°C ~ 25°C) |
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- immediate |
Kester Solder |
1 |
RoHS non-compliant |
331 |
Spool |
Active |
Datasheet
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Wire Solder | Sn63Pb37 (63/37) | 0.025" (0.64mm) | 361°F (183°C) | Water Soluble | 22 AWG, 23 SWG | Leaded | Spool, 1 lb (454 g) | 36 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - |
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- immediate |
SRA Soldering Products |
1 |
RoHS non-compliant |
- |
Spool |
Active |
Datasheet
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Wire Solder | Sn96Ag4 (96/4) | 0.032" (0.81mm) | 430°F (221°C) | Rosin Activated (RA) | 17 AWG, 18 SWG | Lead Free | Spool, 1 lb (454 g) | - | - | - | - |
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- immediate |
Chip Quik Inc. |
1 |
ROHS3 Compliant |
CHIPQUIK® SMD4300 |
Bulk |
Active |
Datasheet
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Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean, Water Soluble | - | 5 | Leaded | Jar, 8.8 oz (250g) | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
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- immediate |
Kester Solder |
1 |
RoHS non-compliant |
285 |
Bulk |
Active |
Datasheet
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Wire Solder | Sn60Pb40 (60/40) | 0.031" (0.79mm) | 361 ~ 374°F (183 ~ 190°C) | Rosin Mildly Activated (RMA) | 20 AWG, 22 SWG | Leaded | Spool, 1 lb (454 g) | 36 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - |
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- immediate |
Kester Solder |
1 |
RoHS non-compliant |
245 |
Bulk |
Active |
Datasheet
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Wire Solder | Sn62Pb36Ag2 (62/36/2) | 0.031" (0.79mm) | 354°F (179°C) | No-Clean | 20 AWG, 22 SWG | Leaded | Spool, 1 lb (454 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - |
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- immediate |
Kester Solder |
1 |
RoHS non-compliant |
285 |
Bulk |
Active |
Datasheet
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Wire Solder | Sn62Pb36Ag2 (62/36/2) | 0.031" (0.79mm) | 354°F (179°C) | Rosin Mildly Activated (RMA) | 20 AWG, 22 SWG | Leaded | Spool, 1 lb (454 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - |
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- immediate |
Kester Solder |
1 |
RoHS non-compliant |
HydroMark 531 |
Bulk |
Active |
Datasheet
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Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | Water Soluble | - | 3 | Leaded | Jar, 17.64 oz (500g) | 6 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) |
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- immediate |
Harimatec Inc. |
1 |
ROHS3 Compliant |
LOCTITE® GC 10 |
Bulk |
Active |
Datasheet
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Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423°F (217°C) | No-Clean | - | - | Lead Free | Jar, 17.64 oz (500g) | 12 Months | Date of Manufacture | 41°F ~ 77°F (5°C ~ 25°C) |
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- immediate |
Kester Solder |
1 |
RoHS non-compliant |
EP256 |
Bulk |
Active |
Datasheet
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Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 3 | Leaded | Cartridge, 21.16 oz (600g) | 6 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) |
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- immediate |
Kester Solder |
1 |
ROHS3 Compliant |
NXG1 |
Bulk |
Active |
Datasheet
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Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 424°F (217 ~ 218°C) | No-Clean | - | 3 | Lead Free | Jar, 17.64 oz (500g) | 8 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) |
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- immediate |
Kester Solder |
1 |
ROHS3 Compliant |
275 |
Bulk |
Active |
Datasheet
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Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.062" (1.57mm) | 423 ~ 424°F (217 ~ 218°C) | No-Clean | 14 AWG, 16 SWG | Lead Free | Spool, 1 lb (454 g) | 36 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - |
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- immediate |
Chip Quik Inc. |
1 |
ROHS3 Compliant |
SMD2 |
Bulk |
Active |
Datasheet
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Wire Solder | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | 0.040" (1.02mm) | 280°F (138°C) | No-Clean, Rosin Activated (RA) | - | Lead Free | Spool, 7 oz (200g) | - | - | - | - |
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